View HLMP-HM70_9020256.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

avago technologies - 1 - description the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv inhibitors to reduce the effects of long-term exposure to direct sunlight. applications ? mono color signs features ? well-defined spatial radiation patterns ? high brightness material ? available in green and blue color green ingan 525 nm blue ingan 470 nm ? superior resistance to moisture ? standoff and non stand-off package ? tinted and diffused ? typical viewing angle 40 x 100 caution ingan devices are class 1c hbm esd sensitive per jedec standard. observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details. HLMP-HM70/hm71, hlmp-hb70/hb71 green and blue 5mm standard oval leds data sheet package dimensions a b cathode lead 5.20 0.204 1.02 0.040 max. 0.70 0.028 max. 7.00 0.275 25.00 0.984 min. sq. typ. 0.020 0.004 0.50 0.10 1.00 0.039 min. 2.54 0.10 3.80 0.150 cathode lead 5.20 0.20 0.205 0.008 10.45 0.50 0.41 0.020 7.00 0.20 0.276 0.008 1.30 0.20 0.051 0.008 1.02 0.040 max. 1.00 0.039 min. 24.00 0.945 min. sq typ. 0.50 0.10 0.020 0.004 3.80 0.20 0.150 0.008 2.54 0.30 0.10 0.012 measured at base of lens. notes: all dimensions in millimeters (inches). tolerance is 0.20 mm unless otherwise specified.
avago technologies - 2 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet device selection guide device selection guide part numbering system note: refer to ab 5337 for complete info rmation on the part numbering system. part number color and dominant wavelength ? d (nm), typ a a. the dominant wavelength, ? d , is derived from the cie chromaticity diag ram and represents the color of the lamp. luminous intensity iv (mcd) at 20 ma b,c,d b. the luminous intensity is measured on th e mechanical axis of the la mp package, and it is tested with pulsing condition. c. the optical axis is closely aligne d with the package mechanical axis. d. tolerance for each intensity bin limit is 15%. standoff package drawing min max hlmp-hb70-tvbdd blue 470 800 1380 no a hlmp-hb70-tvcdd blue 470 800 1380 no a hlmp-hb71-tvbdd blue 470 800 1380 yes b hlmp-hb71-tvcdd blue 470 800 1380 yes b HLMP-HM70-23bdd green 525 3500 5040 no a HLMP-HM70-23cdd green 525 3500 5040 no a hlmp-hm71-23bdd green 525 3500 5040 yes b hlmp-hm71-23cdd green 525 3500 5040 yes b packaging option dd: ammopack color bin selection b: color bin 2 and 3 c: color bin 3 and 4 maximum intensity bin refer to device selection guide. minimum intensity bin refer to device selection guide. standoff/non standoff 70: without standoff 71: with standoff color b: blue m: green package h: 5mm standard oval 40 x 100 hlmp-h x xx C x x x x x
avago technologies - 3 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet absolute maximum ratings absolute maximum ratings t a = 25 c electrical/optical characteristics t a = 25 c parameter blue and green unit dc forward current a a. derate linearly as shown in figure 4 . 30 ma peak forward current 100 b b. duty factor 10%, frequency 1 khz. ma power dissipation 110 mw led junction temperature 110 c operating temperature range C40 to +85 c storage temperature range C40 to +100 c parameter symbol min typ max unit test conditions forward voltage green and blue v f 2.8 3.1 3.6 v i f = 20 ma reverse voltage a green and blue a. indicates product final testing condition; long-term reverse bias is not recommended. v r 5v i r = 10 a dominant wavelength b green blue b. the dominant wavelength is derived from the chromati city diagram and represents the color of the lamp. ? d 520 460 525 470 540 480 nm nm i f = 20 ma peak wavelength green blue ? peak 517 461 nm nm peak of wavelength of spectral distribution at i f =20ma thermal resistance r ? j-pin 240 c/w led junction-to-cathode lead luminous efficacy c green blue c. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / v , where i v is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. v 475 68 im/w emitted luminous flux/electrical power
avago technologies - 4 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet ingan blue and green ingan blue and green figure 1 relative intensity vs. wavelength figure 2 forward current vs. forward voltage 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 relative intensity wavelength - nm blue green 0 5 10 15 20 25 30 01234 forward current - ma forward voltage - v figure 3 relative intensity vs. forard current figure 4 maximum forard current vs. amient temperature 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0 5 10 15 20 25 30 35 relative luminous intensity (normalized at 20 ma) dc forward current - ma 0 5 10 15 20 25 30 35 0 20406080100 t a - ambient temperature - c if max. - maximum forward current - ma figure 5 relative dominant wavelength vs forward current green blue -4 -2 0 2 4 6 8 10 12 relative dominant wavelength - nm 0 5 10 15 20 25 30 forward current - ma
avago technologies - 5 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet ingan blue and green figure 6 radiation pattern, major axis figure 7 radiation pattern, minor axis 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 normalized intensity angular displacement - degrees 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 normalized intensity angular displacement - degrees figure 8 relative light output vs junction temperature figure 9 forward voltage shift vs junction temperature blue green 0.1 1 10 -40 -20 0 20 40 60 80 100 120 relative light output (normalzied @ t j = 25 c) t j - junction temperature blue green -0.3 -0.2 -0.1 0.1 0.2 0.3 -40 -20 0 20 40 60 80 100 120 forward voltage shift - v t j - junction temperature 0
avago technologies - 6 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet intensity bin limits (1.2: 1 iv bin ratio) intensity bin limits (1.2: 1 iv bin ratio) green color bin table blue color bin table bin a a. tolerance for each bin limit is 15%. intensity (mcd) at 20 ma bin a intensity (mcd) at 20 ma min max min max t 800 960 y 1990 2400 u 960 1150 z 2400 2900 v 1150 1380 1 2900 3500 w 1380 1660 2 3500 4200 x 1660 1990 3 4200 5040 bin a a. tolerance for each bin limit is 0.5 nm. min dom max dom xmin ymin xmax ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 bin a a. tolerance for each bin limit is 0.5 nm. note: all bin categories are esta blished for classification of products. products may not be available in all bin categories. p lease contact your avago representative for further information. min dom max dom xmin ymin xmax ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327
avago technologies - 7 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet precautions precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use the proper tool to precisely form and cu t the leads to the applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand soldering operation, as the excess lead length also acts as small heat sink. soldering and handling ? take care during pcb assemb ly and soldering process to prevent damage to the led component. ? led component may be effectively hand soldered to pcb. however, it is recommended only under unavoidable circumstances, such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59 mm. soldering the led using soldering iron tip closer than 1.59 mm might damage the led. ? esd precautions must be properly applied on the soldering station and personne l to prevent esd damage to the led component that is esd sensitive. refer to avago application note an 1142 for details. the soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. the customer is advised to perform daily checks on the soldering profile to ensure that it is always conforming to recommended soldering conditions. note pcbs with different size and design (component density) will have different heat mass (heat capacity). this might cause a change in temperature experienced by the board if the same wave soldering setting is used. so, it is recommended to recalibrate the soldering profile again before loading a new type of pcb. avago technologies led configuration ? any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on led. nonmetal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, the pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. ? if the pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be so ldered on the top side of the pcb. if the surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion the th led. wave soldering a,b a. above conditions refer to measurement with thermocouple mounted at the bottom of pcb. b. it is recommended to use only bo ttom preheaters in order to reduce thermal stress experienced by led. manual solder dipping pre-heat temperature 105 c max. preheat time 60 sec max peak temperature 260 c max. 260 c max. dwell time 5 sec max. 5 sec max 1.59mm cathode ingan device
avago technologies - 8 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet application precautions ? the following table shows the recommended pc board plated through holes (pth) size for led component leads. ? over-sizing the pth can lead to a twisted led after clinching. on the other hand, under-sizing the pth can cause difficulty when inserting the th led. note refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. application precautions ? the drive current of the led must not exceed the maximum allowable limit across temperature as stated in the data sheet. constant current driving is recommended to ensure consistent performance. ? leds do exhibit slightly different characteristics at different drive currents that might result in larger performance variations (such as intensity, wavelength, and forward voltage). the user is recommended to set the application current as close as possible to the test current to minimize these variations. ? the led is not intended for reverse bias. use other appropriate components for such purposes. when driving the led in matrix form, it is crucial to ensure that the reverse bias voltage does not exceed the allowable limit of the led. led component lead size diagonal plated through hole diameter 0.45 0.45 mm (0.018 0.018 inch) 0.636 mm (0.025 in.) 0.98 to 1.08 mm (0.039 to 0.043 in.) 0.50 x 0.50 mm (0.020 0.020 inch) 0.707 mm (0.028 in.) 1.05 to 1.15 mm (0.041 to 0.045 in.) example of wave soldering temperature profile for th led recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec max time (sec) 260c max 105c max temperature (c)
avago technologies - 9 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet ammo packs drawing ammo packs drawing packaging box for ammo packs 6.351.30 0.250.0512 12.701.00 0.500.0394 cathode 20.501.00 0.80710.0394 4.000.20 0.15750.008 0.700.20 0.02760.0079 12.700.30 0.500.0118 9.1250.625 0.35930.0246 18.000.50 0.70870.0197 typ ? view a - a a a
avago technologies - 10 - HLMP-HM70/hm71, hlmp-hb70/hb71 data sheet packaging labels packaging labels (i) avago mother label: (available on pack aging box of ammo pa ck and shipping box) (ii) avago baby label (only available on bulk packaging) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 260c (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max tem p 260c lam p s bab y label
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago technologies and the a logo are tradem arks of avago technologies in the united states and other countries. all other brand and product names may be trademarks of their respective companies. data subject to change. copyright ? 2005-201 6 avago technologies. all rights reserved. av02-3730en C july 13, 2016 lead (pb) free rohs 6 fully compliant acronyms and definitions bin: ? (i) color bin only or vf bin only applicable for part number with color bins but without vf bin or part number with vf bins and no color bin or ? (ii) color bin incorporated with vf bin applicable for part number that have both color bin and vf bin example: ? (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) ? (ii) color bin incorporate with vf bin bin: 2vb, where: ? 2 is color bin 2 only ? vb is vf bin "vb" disclaimer : avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, cons truction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, da mage, expense or liability in connection with such use.

▲Up To Search▲

Price & Availability of HLMP-HM70

	To Download HLMP-HM70 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .